Introduction to microsystem packaging technology

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Introduction to microsystem packaging...

Introduction to microsystem packaging technology

Yufeng Jin, Zhiping Wang, Jing Chen

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श्रेणियाँ:

साल:

2011

प्रकाशन:

CRC Press/Taylor & Francis

भाषा:

english

पृष्ठ:

229

ISBN 10:

1439819106

ISBN 13:

9781439819104

फ़ाइल:

PDF, 3.82 MB

IPFS:

,

english, 2011

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Ulrich R.K., Brown W.D. (Ed.) — Advanced Electronic Packaging

John H. Lau — Flip Chip Technologies

Ken Gilleo — Area Array Packaging Handbook: Manufacturing and Assembly

Rao R. Tummala — Fundamentals of Microsystems Packaging

Ephraim Suhir — Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume 1 Materials Physics Materials ... Physical Design Reliability and Packaging

Tapan K. Gupta(auth.) — Handbook of Thick- and Thin-Film Hybrid Microelectronics

John G. Webster (Editor) — 11.Components, Packaging, and Manufacturing Technology

Robert J. Hannermann, Allan D. Kraus, Michael Pecht — Physical Architecture of Vlsi Systems

Thomas Moore (Eds.) — Characterization of Integrated Circuit Packaging Materials

Puligandla Viswanadham, Dereje Agonafer — Essentials of electronic packaging: a multidisciplinary approach

James J Licari; Leonard R Enlow — Hybrid microcircuit technology handbook: materials, processes, design, testing and production

Michael Pecht (Editor) — Handbook of Electronic Package Design

Taraseiskey — Power hybrid circuit design and manufacture

Johnson R.W., Teng R.K.F., Balde J. — Multichip Modules: Systems Advantages, Major Constructions, and Materials Technologies

Lee, S. W. Ricky, Lo, Jeffery C. C. — From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications

Keser, Beth; Kroehnert, Steffen — Advances in embedded and fan-out wafer level packaging technologies

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Andrea Chen, Randy Hsiao-Yu Lo — Semiconductor Packaging: Materials Interaction and Reliability

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William Greig — Integrated Circuit Packaging, Assembly and Interconnections

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Muhannad S. Bakir, James D. Meindl — Integrated Interconnect Technologies for 3D Nanoelectronic Systems

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